Thermal solutions with microfluidic structures
The challenge of precision equipment is how to prevent the heat coming from the components in equipment. And this heat issue will be remarkable for new technology, such as 5G.
The lifetime and quality are also determined by heat, so it is very important to design how to dissipate the heat from components.
UPT develop the new “Heat Sink” which has the micro-flow channel.
The appearance of this heat sink is very simple, but it is very complex air and liquid pathways inside the Heat Sink developed by combination of photo etching and diffusion bonding technology owned by UPT.
Issues with using heat sink
Proposal
Success Story
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