Smallest, Thinnest, and Finest.
New Future Pioneered with Photo Etching and Diffusion Bonding Technology.
Solving Issues with Ultra Precision Technology .
Manufacturing Partner for Cutting-edge Fields with Semiconductors.
Why UPT?
Smallest, Thinnest, and Finest
Combining photo etching and diffusion bonding technology, we excel in ultra-precision metal processing that combines improved functionality with smaller and thinner products. UPT is your partner for technological innovation in all kinds of devices.
High Quality, Low Cost, and Short Lead Times
UPT always researches new technologies to improve product performance and reduce costs in order to respond to customer requests and market changes.
UPT also excels at cost reductions by utilizing our factories, and we are able to respond to short lead times with our extensive inventory of materials.
Reliable Support with an Integrated Production System
Our specialists with expertise in various fields can handle the entire process from specification design, prototyping, mass production, to post-processing. We also offer multilingual support (Japanese, English, Chinese, Korean, and Thai).
Our Technologies
Photo Etching Technology
Excellent at forming precise, unique and complex metal parts.
Diffusion Bonding Technology
Allowing for creation of metal parts with complex 3D internal structures.
Our Core Products
VCM Spring
A crucial component for smartphone camera modules, within the actuator system.
Shim Spacer
Thin, plate-like metal component to adjust the position and fill gaps of machine parts.
Liquid Cooling Plate
A cooling device with channels for coolant to flow through, used to help cool down electronic equipment and semiconductor devices.
Electronic Component Tray
Specialized tray used for transporting electronic components and semiconductors.
Liquid-Cooled Heat Sink
A water-cooled cooling system that provides with highly efficient cooling and is particularly suitable for high-performance electronic equipment.
Custom Layered Metal Mesh Filter
Filters with precise patterns and microstructures by photo-etching and diffusion bonding technologies.
Semiconductor Final Test Solutions
Test Socket Micro Metal Socket®
Test sockets adaptable to the miniaturization and narrow pitch requirements of next-generation semiconductors.
Anisotropic Conductive Film UHSS®
High design and high-speed signal characteristics enable more efficient semiconductor testing and higher performance electronic devices.
NEWS
Case Studies / Columns
High-resolution linear encoder scales
Wheel encoder discs
Polyimide heaters with coppor foil etching
Magnesium Audio Equipment by Photo Etching
Union Filter®
