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Microfluidic Structure Cooling Tech™ | Created with Etching + Diffusion Bonding
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HOME
TECHNOLOGIES
Photo Etching Technology
Half-Etching
Photo-Etching of Magnesium Alloys
Diffusion Bonding Technology
PRODUCTS
Solutions for Semiconductor Final Test
Anisotropic Conductive Film – UHSS®
Test Socket – MMS
Test Probe Pin – Union Contact™
Thermal Management of Electronic Devices
Liquid Cooling Plates
Liquid-Cooled Heat Sinks
Small / Thin Heat Sinks
Custom Shims
Shim Spacers
Ring / Round Shims
Shim Plates
VCM spring
Electronic Component Trays
Custom Layered Metal Mesh Filters
CASE STUDIES
ABOUT UPT
GET IN TOUCH
ENGLISH
JAPANESE
中文 (繁体)
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