High-Performance Thermal Management with Photo Etching and Diffusion Bonding Technology
What is Thermal Management?
Thermal management deals with the heat generated by electronic devices and equipment efficiently. As electronic devices get more powerful and compact, thermal management comes more essential. Keeping device operation environment below specified temperatures preserves performance and extends the lifespan of devices and equipment. UPT offers customized thermal solutions to address clients’ specific challenges.
Advantages of UPT’s Thermal Management
Microchannel Structures for Efficient Heat Dissipation
The combination of photo etching and diffusion bonding technology enables the formation of complex channels with high thermal conductivity. This combination realizes a micro-channel structure with high cooling performance, allowing for efficient thermal management.
Small Size and Footprint
UPT can fabricate the complex heat dissipation paths, allowing miniaturization of heat dissipation components and making them suitable for devices or system that require space saving.
Reduced Initial Costs
Since no molds or other initial equipment are required, trial and error during the prototype and design phases are simplified and reduce the initial costs, allowing for the fast development of optimal heat dissipation designs.
Short Lead Times
In addition to reducing initial costs, the strengths of our photo etching and diffusion bonding technology contribute to short lead times.
Leak Test
UPT can conduct leak tests before shipping, to ensure the reliability of our thermal solutions.
Use-Cases
Liquid Cooling Plates
Liquid cooling plates are critical thermal management devices for electronic devices and semiconductor devices. UPT maximizes the thermal management capabilities of these devices with the combination of photo etching and diffusion bonding technologies.
Liquid-Cooled Heat Sinks
These cooling devices efficiently remove heat from high-performance components in electronic devices and computers. UPT enhances the heat dissipation capabilities of these devices through the combination of photo etching and diffusion bonding technologies.
Small / Thin Heat Sinks
UPT manufactures small / thin heat sinks with microchannels using our unique process that combines photo etching and diffusion bonding technologies. These heat sinks have high heat dissipation capabilities despite their compact size.