We enhance customers' testing process more time and cost efficient.
Rubber Sheet for High Frequency Micro Metal Socket®
Implement UPT’s original Contact pins(U-Contact) on the silicon rubber sheet, and flexible layout for contact on both sides.
Features

Insulator : Original Silicon Rubber Sheet
Contact Height | 0.45mm~ |
Pitch | 0.15mm~ |
High Speed | 60GHz@-1dB |
Long Lifetime/Lifecyle/Repeatability | 50K times |
Low Force | <0.24N |
Current | 1A |
Customize is available | Please ask us |
Thinnest “0.05mm” Sheet Contact Union High Speed Sheet “UHSS®”
UPT proposes UHSS® as a connection terminal to the board for evaluation, measurement, and inspection of ultra-small devices.
Features

Insulator : High-performance plastic fibers
Rated current | 3A/ dot (per contact) |
Signal rates | 100GHz @-1dB |
Touchdowns | 50,000 times of lifetime |
Thickness | 0.05 mm with double-sided metal contact |
Bending angle | up to 180° |
Contact size | See below table |
Specifications

Dimension | Spec |
---|---|
Pitch(Px) | 0.08㎜~ |
Pitch(Py) | 0.08㎜~ |
Thickness(T) | 0.05㎜~ |
Electrode size(L) | □0.06㎜~ |
Size(X) | 5.00㎜~ |
Size(Y) | 5.00㎜~ |
Cold Plate with Microchannel for Thermal Solutions
UPT offers the Union Cooling Tech® with micro-channels for the equipment which is required the high heat dissipation with small precision equipment.
Application

- IC test handler for heat cycle test
- Heat sink for enterprise product
- Heat exchanger for industrial equipment
Features
Thermal resistance | 0.035-0.045 [℃/W] |
Pressure Loss | 0.35-0.7 [MPa] (5-10 [PSID]) |
Flow rate | 4 [LPM] |
Heat uniformity | less than 0.05 [℃/W] *Size: 50x50x10mm/ Temp. of water: 25℃/ Flow rate: 4 l/min |
Maximum Size | 450x450x400mm *If any for capability of product, please contact us freely |
Material & Dimension | See below table |
Specifications
Items | Availability & Capability |
---|---|
Metal type | Copper |
Metal thickness | 50μm~ |
Processing accuracy | Etching process accuracy: ±10% (relative to metal thickness) Stacking misalignment processing accuracy: ±20μm |
Surface treatment | Plating such as nickel works as a surface treatment after bonding |
Union Contact ™
Semiconductor test solutions
As semiconductor is getting more layered, testing process is getting more complex. We enhance customers' testing process more time and more cost efficient.
Union Alloy ™
Original alloy with superior performance
We developed original alloy with the same level of conductivity as copper and it also holds better strengthen.