We enhance customers' testing process more time and cost efficient.

Rubber Sheet for High Frequency Micro Metal Socket®

Implement UPT’s original Contact pins(U-Contact) on the silicon rubber sheet, and flexible layout for contact on both sides.

Features

Material  : Copper Alloy (w/ AU plating)
Insulator :  Original Silicon Rubber Sheet
Contact Height0.45mm~
Pitch0.15mm~
High Speed60GHz@-1dB
Long Lifetime/Lifecyle/Repeatability50K times
Low Force<0.24N
Current1A
Customize is availablePlease ask us

Thinnest “0.05mm” Sheet Contact Union High Speed Sheet “UHSS®

UPT proposes UHSS® as a connection terminal to the board for evaluation, measurement, and inspection of ultra-small devices.

Features

Material  : Copper Alloy (w/ AU plating)
Insulator :  High-performance plastic fibers
Rated current3A/ dot (per contact)
Signal rates100GHz @-1dB
Touchdowns50,000 times of lifetime
Thickness0.05 mm with double-sided metal contact
Bending angleup to 180°
Contact sizeSee below table

Specifications

DimensionSpec
Pitch(Px)0.08㎜~
Pitch(Py)0.08㎜~
Thickness(T)0.05㎜~
Electrode size(L)□0.06㎜~
Size(X)5.00㎜~
Size(Y)5.00㎜~

Cold Plate with Microchannel for Thermal Solutions

UPT offers the Union Cooling Tech® with micro-channels for the equipment which is required the high heat dissipation with small precision equipment.

Application

  • IC test handler for heat cycle test
  • Heat sink for enterprise product
  • Heat exchanger for industrial equipment  

Features

Thermal resistance0.035-0.045 [℃/W] 
Pressure Loss0.35-0.7 [MPa]  (5-10 [PSID])
Flow rate4 [LPM]
Heat uniformityless than 0.05 [℃/W]
*Size: 50x50x10mm/ Temp. of water: 25℃/ Flow rate: 4 l/min
Maximum Size450x450x400mm
*If any for capability of product, please contact us freely 
Material & DimensionSee below table

Specifications

ItemsAvailability & Capability
Metal typeCopper
Metal thickness50μm~
Processing accuracyEtching process accuracy: ±10% (relative to metal thickness)
Stacking misalignment processing accuracy: ±20μm
Surface treatmentPlating such as nickel works as a surface treatment after bonding

Union Contact ™
Semiconductor test solutions

As semiconductor is getting more layered, testing process is getting more complex. We enhance customers' testing process more time and more cost efficient.

Union Alloy ™
Original alloy with superior performance

We developed original alloy with the same level of conductivity as copper and it also holds better strengthen.