We enhance customers' testing process more time and cost efficient.
Rubber Sheet for High Frequency Micro Metal Socket®
Implement UPT’s original Contact pins(U-Contact) on the silicon rubber sheet, and flexible layout for contact on both sides.
Features
Insulator : Original Silicon Rubber Sheet
| Contact Height | 0.45mm～ |
| Pitch | 0.15mm～ |
| High Speed | 60GHz@-1dB |
| Long Lifetime/Lifecyle/Repeatability | 50K times |
| Low Force | <0.24N |
| Current | 1A |
| Customize is available | Please ask us |
Thinnest “0.05mm” Sheet Contact Union High Speed Sheet “UHSS®”
UPT proposes UHSS® as a connection terminal to the board for evaluation, measurement, and inspection of ultra-small devices.
Features
Insulator : High-performance plastic fibers
| Rated current | 3A/ dot (per contact) |
| Signal rates | 100GHz @-1dB |
| Touchdowns | 50,000 times of lifetime |
| Thickness | 0.05 mm with double-sided metal contact |
| Bending angle | up to 180° |
| Contact size | See below table |
Specifications
| Dimension | Spec |
|---|---|
| Pitch（Px） | 0.08㎜～ |
| Pitch（Py） | 0.08㎜～ |
| Thickness（T） | 0.05㎜～ |
| Electrode size（L） | □0.06㎜～ |
| Size（X） | 5.00㎜～ |
| Size（Y） | 5.00㎜～ |
Cold Plate with Microchannel for Thermal Solutions
UPT offers the Union Cooling Tech® with micro-channels for the equipment which is required the high heat dissipation with small precision equipment.
Application
- IC test handler for heat cycle test
- Heat sink for enterprise product
- Heat exchanger for industrial equipment
Features
| Thermal resistance | 0.035-0.045 [℃/W] |
| Pressure Loss | 0.35-0.7 [MPa] (5-10 [PSID]) |
| Flow rate | 4 [LPM] |
| Heat uniformity | less than 0.05 [℃/W] ＊Size: 50x50x10mm/ Temp. of water: 25℃/ Flow rate: 4 l/min |
| Maximum Size | 450x450x400mm ＊If any for capability of product, please contact us freely |
| Material & Dimension | See below table |
Specifications
| Items | Availability ＆ Capability |
|---|---|
| Metal type | Copper |
| Metal thickness | 50μm～ |
| Processing accuracy | Etching process accuracy: ±10% (relative to metal thickness) Stacking misalignment processing accuracy: ±20μm |
| Surface treatment | Plating such as nickel works as a surface treatment after bonding |
Union Contact ™
Semiconductor test solutions
As semiconductor is getting more layered, testing process is getting more complex. We enhance customers' testing process more time and more cost efficient.
Union Alloy ™
Original alloy with superior performance
We developed original alloy with the same level of conductivity as copper and it also holds better strengthen.