We enhance customers’ testing process more time and cost efficient.
World's thinnest "0.05mm" Sheet Contact
Union High Speed Sheet "UHSS"
Up-to-date contact, completely changed the concept of conventional semiconductor testing enabling to use for wafer/package/system level in all phases from prototype through mass-production,
Current tolerance of 3A per dot, unachievable with conventional sheet-type contacts * Figure determined through testing by UPT
200 Gbps high-frequency support through ultra-short transmission paths with thicknesses as low as 0.05 mm * Figure determined through testing by UPT
・Fine pitch / Minimal contact point
Pitch: 0.08mm~, Contact point(=dot): 0.06mm~
Durability of 50,000 uses and above, capable of withstanding mass production process use * Figure determined through testing by UPT
Union Contact ™
Semiconductor test solutions
As semiconductor is getting more layered, testing process is getting more complex. We enhance customers' testing process more time and more cost efficient.
Union Alloy ™
Original alloy with superior performance
We developed original alloy with the same level of conductivity as copper and it also holds better strengthen.
Union Socket Ninja™
For Device Testing
To apply Union Contact™ for your device testing, we developed Union Socket Ninja™.
Ask a sales staff for the semi-custom type test socket.