Thermal Solutions

Driven by the miniaturization of electronic devices, increased power density, high-performance computing demands, and higher data transfer rates, the quest for efficient thermal management solutions in next-generation electronic components and devices has intensified.
At UPT, we offer advanced thermal management solutions with the precision of photo etching and the strength of diffusion bonding. Our solutions deliver exceptional durability and versatility, from prototyping to mass production.
One of the key advantages is its time-effectiveness. Unlike conventional methods that require specialized and costly molds, our approach accelerates your prototyping phase, allowing for faster progress.

UPT offers advanced thermal management solutions featuring microfluidic structures—a feat not easily achievable through conventional processes. 

• Enhanced Heat Dissipation: Microfluidic channels and structures enhance heat dissipation by efficiently circulating coolant or liquid through the channels. This results in improved temperature regulation, preventing overheating and ensuring optimal electronic performance.
• Precise Temperature Control: Microfluidic systems offer precise temperature control within electronic components. This level of precision is crucial for maintaining the stability and reliability of sensitive electronic devices.
• Compact Form Factor: Microfluidic systems are inherently compact and can be seamlessly integrated directly into electronic components or assemblies. This saves space and minimizes the overall footprint of the device, optimizing its design.

By integrating etching and diffusion bonding techniques, we provide cooling plates that are versatile, suitable for both water-cooling and air-cooling systems. These cooling plates are designed to accommodate a broad spectrum of applications, ranging from compact heat sinks for semiconductor packages to large heat exchangers like those used in hydrogen stations.

• Adhesive-Free Design: Cooling plates manufactured with photo etching and diffusion bonding do not require adhesives or glue for their assembly. This eliminates the risk of adhesive degradation, ensuring long-term reliability and reducing maintenance concerns.
• Reduced Weight and Size: Cooling plates made using these techniques can be lightweight and compact while maintaining high thermal efficiency, which is essential in applications where space and weight constraints are important.