NEPCON JAPAN 2024 Exhibit Information

United Precision Technologies will exhibit at NEPCON JAPAN 2024, held from January 24th to 26th in Tokyo, Japan.
We will participate in a joint exhibition within the booth of the Japan Micro Manufacturing Association as a member company.
Utilizing our expertise in precision microfabrication, we employ “Photo Etching Technology” and “Diffusion Bonding Technology” to achieve fine and complex three-dimensional processing with superior strength and durability that was previously impossible with conventional processing methods.
We look forward to seeing you at the exhibition.

Main Exhibit

At Nepcon Japan, we will primarily exhibit diffusion bonding products.
Diffusion bonding creates strong and lasting connections between materials by heating and pressuring them together at the atomic level, without adhesive.
The adhesive or spot welding methods are commonly used for jointing the metal to metal, but there are numerous challenges. Issues such as peeling at high temperatures, difficulty in cleaning, and the formation of gaps in spot welding are common concerns.
Complex 3D components can be produced by stacking and bonding photo etched plates, making it a versatile technique. In combination with photo etching, it allows for the creation of hollow structures, that is something other methods cannot achieve.

Advantages

High strength with minimal dimensional changes.
Clean finish with no issues of gas generation, and easy cleaning of excess material.
Mass production.
Available to create the hollow structure, such as deep holes and taperad holes.
High robustness and heat resistance.

Any questions about our products and technologies?

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