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TECHNOLOGIES
Photo Etching Technology
Half-Etching
Photo-Etching of Magnesium Alloys
Diffusion Bonding Technology
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Anisotropic Conductive Film – UHSS®
Test Socket – MMS
Test Probe Pin – Union Contact™
Thermal Management of Electronic Devices
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Liquid-Cooled Heat Sinks
Small / Thin Heat Sinks
Customized design backing plates
Custom Shims
Shim Spacers
Ring / Round Shims
Shim Plates
Others
Electronic Component Trays
Custom Layered Metal Mesh Filters
Disc and scale for optical rotary encoder
VCM spring
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HOME
TECHNOLOGIES
Photo Etching Technology
Half-Etching
Photo-Etching of Magnesium Alloys
Diffusion Bonding Technology
PRODUCTS
Solutions for Semiconductor Final Test
Anisotropic Conductive Film – UHSS®
Test Socket – MMS
Test Probe Pin – Union Contact™
Thermal Management of Electronic Devices
Liquid Cooling Plates
Liquid-Cooled Heat Sinks
Small / Thin Heat Sinks
Customized design backing plates
Custom Shims
Shim Spacers
Ring / Round Shims
Shim Plates
Others
Electronic Component Trays
Custom Layered Metal Mesh Filters
Disc and scale for optical rotary encoder
VCM spring
CASE STUDIES
ABOUT UPT
GET IN TOUCH
ENGLISH
JAPANESE
中文 (繁体)
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