Product Technology

Press Release
Probe Pin Saver™

Anisotropic Conductive Sheet Protects Probe Pins from Solder Transfer, and Protects from Damage due to contact […]

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Press Release
Union Filter®

The 3D microporous metal filter created by etching and diffusion bonding Filters are used in a variety of prod […]

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Press Release
Metal LID sealing for electronic components and semiconductor packages.

Metal LID Semiconductor packages is very important to secure the quality, and semiconductor package technology […]

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Press Release
Cooling Tech™

Microfluidic structure Cooling Tech™ created by etching + diffusion bonding The next generation of thermal con […]

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Press Release
Metal Foil Heaters For Electrostatic Chucks

Electrostatic Chuck with Built-in Heater Proposal Specification List

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Press Release
Union High Speed Sheet: UHSS

Upgrade the evaluation performance and durability without changing the equipment you have now. UHSS-LS / UHSS- […]

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Press Release
Microfabrication Slit Solution For Optical Encoders

Optical Encoders Proposal Specification List

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Press Release
Union Tray® High-precision trays to improve efficiency of electronic component manufacturing process.

Union Tray® High-precision metal products made by "etching + diffusion bonding" The role of electronic compone […]

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Press Release
For the final tuning/adjustment of tolerances and cumulative errors

Fine tuning of tolerances and accumulated errors UPT offers new Shim Spacers solution which is the ring shim s […]

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Product Technology
Union Cooling Tech® with Microchannel for Thermal Solutions.

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